Machining characteristics of glass substrates containing chemical components in femtosecond laser helical drilling
- 주제(키워드) Femtosecond laser , Glass , Glass chemicals , Helical drilling
- 등재 SCIE, SCOPUS, KCI등재
- 발행기관 Korean Society for Precision Engineeing
- 발행년도 2021
- 총서유형 Journal
- URI http://www.dcollection.net/handler/ewha/000000181357
- 본문언어 영어
- Published As http://dx.doi.org/10.1007/s40684-020-00242-2
- 저작권 이화여자대학교 논문은 저작권에 의해 보호받습니다.
초록/요약
The machining characteristics of glass substrates containing chemical components were investigated for the purpose of femtosecond laser helical drilling. A femtosecond laser of wavelength 1552 nm and pulse duration 800 fs was adopted in the laser machining system. The substrates investigated were aluminosilicate, soda-lime, and borosilicate glass. The chemical components contained in each glass substrate were quantitatively analyzed by laser ablation-induced chemical plasma mass spectrometry. The characteristics of the drilling conditions for each glass substrate were affected by its chemical components. As the wt% of Al2O3 and MgO components in the glass substrates increased, the ablation threshold energy of each substrate decreased, resulting in greater vertical speed of the laser head. © 2020, Korean Society for Precision Engineering.
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